IEEE Transactions on Power Delivery
The scope of the IEEE Transactions on Power Delivery embraces innovations in electric apparatus for power delivery with a main focus on power transmission and distribution components. It also covers apparatus modeling, analysis, implementation and application issues such as power system protection, instrumentation, communication, and grounding; electromagnetic transients and power quality; and substation automation. The Transaction’s scope further includes research works leading to power engineering standards.
The Impact Factor for the IEEE Transactions on Power Delivery is 3.350.
This publication is a hybrid journal, allowing either Traditional manuscript submission or Open Access (author-pays OA) manuscript submission.
The OA option, if selected, enables unrestricted public access to the article via IEEE Xplore. The OA option will be offered to the author at the time the manuscript is submitted. If selected, the OA discounted fee of $1,950 must be paid before the article is published in the journal. If you have unusual circumstances about this, please contact the Editor-in-Chief. Any other applicable charges (such as the over-length page charge and/or charge for the use of color in the print format) will be billed separately once the manuscript formatting is complete but prior to the publication.
The traditional option, if selected, enables access to all qualified subscribers and purchasers via IEEE Xplore. No OA payment is required.
Overlength Page Charges
Beginning 1 January 2019, overlength page charges will be $150 per each page in excess of the first eight published pages.
Table of Contents
Useful links for authors and reviewers
Every effort will be made to complete the review of your manuscript in three months. If the review has substantially exceeded three months, you may send an inquiry to email@example.com. Be sure to include the manuscript ID number.
Editor in Chief, Wilsun Xu, University of Alberta firstname.lastname@example.org
Editor in Chief, Power Engineering Letters, Mahmud Fotuhi-Firuzabad, Sharif Univ of Technology email@example.com
Editorial Board Members
MANUEL AVENDANO MORA, Southern California Edison, United States
TIANSHU BI, School of Electrical and Electronic Engineering, United States
SUKUMAR M. BRAHMA, New Mexico State University, United States
ANTONIO CATALIOTTI, Università di Palermo, Italy
GARY CHANG, National Chung Cheng University, Taiwan
NILANJAN RAY CHAUDHURI, North Dakota State University, United States
VALENTINA COSENTINO, University of Palermo, Italy
SEBASTIEN DENNETIERE, EDF, France
MOHAMED ELMOURSI, Masdar Institute of Science and Technology, UAE
WALMIR FREITAS, University of Campinas, Brazil
FRANCISCO DE LEON, Polytechnic Institute of NYU, United States
CHRISTIAN M. FRANCK, Swiss Federal Institute of Technology Zurich, Switzerland
ORIOL GOMIS-BELLMUNT, Technical University of Catalonia, Spain
THOMAS E. GREBE, EnerNeX Corporation, United States
JINLIANG HE, Tsinghua University, China
ALI HOOSHYAR, University of Toronto, Canada
BRIAN J JOHNSON, University of Idaho
DRAGAN JOVCIC, Unversity of Aberdeen, United Kingdom
ADRIA JUNYENT-FERRE, Imperial College of UK
S. V. KULKARNI, Indian Institute of Technology, Bombay, India
UDAYA KUMAR, Indian Institute of Science, Bangalore, India
JEAN MAHSEREDJIAN, Ecole Polytechnique, Montreal, Canada
JACOB MERRIMAN, Burns & McDonnell, United States
KAVEH NIAYESH, Norwegian University of Science and Technology, Norway
IGOR PAPIC, University of Ljubljiana, Slovenia
SARATH PERERA, University of Wollongong, Australia
LISA QI, ABB, United States
JIANGCHAO QIN, Arizona State University, United States
AFSHIN REZAEI-ZARE, York University, Canada
SUBHRANSU RANJAN SAMANTARAY, Indian Institue of Technology Bhubaneswar, India
MAJID SANAYE-PASAND, University of Tehran, Iran
KLEBER MELO SILVA, University of Brazil
JOSE CARLOS VIEIRA, University of Sao Paulo, Brazil
PENG WANG, Nanyang Technological University, Singapore
XIANYONG XIAO, Sichuan University of China, China
XIAORONG XIE, Tsinghua University of China, China
LIE XU, University of Strathclyde, United Kingdom of Great Britian and Northern Ireland
GUANGYA YANG, Technical University of Denmark
YI ZHANG, RTDS Technologies, Canada
DONGBO ZHAO, Argonne National Laboratory, United States